Our Sn99Ag0.3Cu0.7 OB-SP307 lead free silver solder paste adopts the alloy which is formed by the 99% tin, the 0.3% silver, and the 0.7% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 140 degrees Celsius to 190 degrees Celsius. The melting temperature about 250 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
Specification of solder paste
Solder Ball Test
Bronze Mirror Corrosion Test
Surface Insulation Impedance
solder paste Sn63Pb37 details:
solder paste storage
1.Paste save allowable temperature 1-10 ºC, the optimum range of 5-10 ºC, the shelf life of six months (counting from the date of manufacture). 2. Prior to use, the solder paste previously removed from the refrigerator at least 4 hours at room temperature, which is to return to work in order to make the paste temperature, but also to prevent moisture condensation on the surface of the solder paste
the use of the environment Paste the best use of the environment: temperature 25±3ºC, humidity of 40 to 70%.
Solde Paste mixing 1.To make the paste is completely mixed, after warmed Please stir paste. 2. Mixing machine generally 1 to 3 minutes, stirring artificial usually 3 to 5 minutes (the longer the paste storage time, stirring longer)
solder paste Sn63Pb37 applicable objects: laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect
1. Your inquiry about our products and price will be replied within 24 hours;
2. Well-trained and experienced staffs to answer all your enquires in fluent English;
3. Best products and price to offer;
4. Shortest time to delivery the products ;
5. Strict QC before shipping the products;
6. OEM & ODM services offered;
7. Good packing!
* All kinds of splice tapes *SMT plier *SMT scissors *Stencil roll *Clean wiper
Anything need, welcome to contact! Samples can be offered to test!